Heat sink with fins｜Copper fin heat sink

Zipper Fins Heat Sinks

Zipper fins provide greater flexibility in design and high aspect ratios. They are economical for larger production runs.
Strong structural stability, both top and bottom fins interlocked. Reliable mechanical support, fins held together on top and bottom.
Bespoke integrated systems with fans, ducting, and heat pipes. Enhance performance. Suitable for high-performance applications with larger production runs.
Zipper Fin heat sinks are perfect for air cooling high-powered forced convection applications at large scale production. Employing interlocked sheet metal fins that are stamped, folded, and zipped together in the zipper fin stack. The length of fins and gaps in the stack can vary by stamping dies, and fins can be open or closed according to airflow needs.

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What are Zipper Fins Heat Sinks

Zipper fin heat sinks, also known as zipper fin heat sinks, are a cooling technology primarily used in electronic devices to manage thermal performance. They are designed to maximize surface area and enhance airflow for more efficient cooling. Zipper fin heatsinks are made from thin sheets of metal, usually made of aluminu m or copper. These pieces of metal are stamped or machined to create an interlocking "zipper" shape. The fins are then assembled mechanically, allowing them to interlock or "zip" together to form a dense array of fins with a high surface area. The interlocking fins are usually attached to a solid base plate, which is also usually made of a thermally conductive material, such as aluminum or copper.

Vaper Chamber Heat sinks
This Zipper Fins Heat Sink is optimized for Vapor Chamber Heat Sinks, featuring an innovative design that maximizes heat dissipation for high-power applications. The zipper fin structure enhances thermal conductivity by providing increased surface area and optimized airflow channels. Made from high-quality materials, it ensures durability and efficient cooling, making it ideal for industrial and electronic applications where reliable thermal management is crucial. The compact yet robust design allows for easy integration into various systems, ensuring consistent performance and effective heat dissipation, even under demanding conditions.

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LM1-OTN – 40Gb/100Gb heatsink
The LM1-OTN heatsink is engineered for 40Gb/100Gb communication modules, providing superior cooling to support high-speed data transmission. Featuring a zipper fin design, it maximizes surface area for efficient heat dissipation, ensuring optimal performance in high-power optical transceivers. Its robust yet lightweight aluminum construction allows for easy installation, while maintaining effective airflow to manage thermal output in densely packed environments. Ideal for telecom applications, this heatsink guarantees reliability and stability for OTN (Optical Transport Network) modules, enabling consistent performance under high loads, making it an excellent solution for data centers and network infrastructure.

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Zipper Fin Heatsink
This Zipper Fin Heatsink is designed to offer efficient thermal management for high-power electronic components. With a unique zipper fin structure, it maximizes surface area to facilitate better airflow and heat dissipation. Made from lightweight aluminum, this heatsink ensures both durability and optimal performance, making it ideal for applications requiring reliable cooling in a compact space. Its robust construction supports consistent operation, while the versatile mounting system allows for easy integration into a variety of setups, making it a perfect choice for telecom, data center, and industrial equipment.

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LM2 - TPD 4x10G LINE - Apheleia Heatsink
The LM2 - TPD 4x10G LINE Apheleia Heatsink is designed for advanced cooling in high-speed networking applications. Featuring a high-performance zipper fin structure, it ensures optimal heat dissipation for 4x10G line modules, maintaining stable operation even under heavy data loads. Its aluminum construction is lightweight yet durable, making it ideal for use in dense telecommunications and data center environments. The compact profile allows easy integration while effectively managing the thermal output of powerful networking devices. This heatsink guarantees consistent performance, providing the thermal reliability necessary for demanding high-speed communication systems.

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Water Dispenser Fin Heatsink
The Water Dispenser Fin Heatsink is engineered to provide efficient cooling for water dispensing systems, ensuring optimal thermal performance for reliable operation. Featuring a high-density zipper fin design, this heatsink maximizes heat dissipation, allowing for effective cooling even in compact environments. Constructed from lightweight and durable aluminum, it ensures a long lifespan and consistent thermal conductivity. The specially designed fins optimize airflow and heat transfer, making it suitable for high-usage water dispensers that require effective heat management for electrical components. Easy to install, this heatsink is ideal for maintaining stable operation and extending equipment longevity.

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