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500 Watt Communication Heat Sink
The 500W Communication Heat Sink with heatpipe cooling technology offers superior thermal management for high-power communication devices. It features copper heatpipes and aluminum fins for efficient heat dissipation, ensuring stable operation and extended device lifespan in demanding environments.

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LM2-200GbMXP CFP2 Heat Sink
The LM2-200GbMXP CFP2 Heat Sink with heatpipe cooling ensures high-efficiency thermal management for high-speed communication modules. Its copper heatpipes and aluminum structure offer superior heat dissipation, maintaining stable performance for 200Gbps systems. Ideal for demanding network environments.

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High Power Stage Lamp Heat Sink
The High Power Stage Lamp Heat Sink is designed for efficient heat dissipation in high-performance lighting systems. Featuring multiple copper heat pipes and large aluminum fins, this heat sink ensures optimal thermal management, extending the lifespan and performance of stage lamps. Ideal for high-wattage applications, it combines robust construction with efficient heat transfer to maintain stable operating temperatures, enhancing reliability in demanding environments. Suitable for professional stage lighting setups where effective cooling is essential for prolonged, high-intensity use.

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SCR Bridge Fins Heat Sink
The SCR Bridge Fins Heat Sink is engineered for high efficiency in cooling silicon-controlled rectifiers (SCRs). Utilizing robust copper heat pipes and a layered aluminum fin design, this heat sink provides excellent thermal conductivity, effectively dissipating heat to maintain stable operation in high-power applications. Ideal for use in power control units, it ensures reliability by managing temperature effectively, improving the longevity and performance of sensitive electronic components. Suitable for industrial applications requiring consistent and efficient thermal management.

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Fluid Cooled Skived Heatsink
The Fluid Cooled Skived Heatsink is designed for efficient heat dissipation in high-performance applications, combining a skived fin structure with fluid cooling channels to enhance thermal management. Ideal for use in electronic devices that demand effective cooling, this heatsink features a precisely engineered skiving process to create uniform and high-density fins, optimizing surface area for improved heat transfer. The integrated fluid cooling further enhances its cooling capabilities, making it perfect for environments requiring superior thermal control, such as data centers, power electronics, and advanced computing systems.

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Cu1100 Skived Heatsink
The Cu1100 Skived Heatsink is constructed from high-quality copper (Cu1100) to ensure superior thermal conductivity and optimal heat dissipation. This skived fin heatsink features tightly spaced fins formed from a single copper block, maximizing surface area for effective cooling. Its excellent thermal properties make it ideal for high-power electronic components, providing reliable heat management for demanding applications, such as power electronics, telecommunications, and industrial automation systems. The skiving process results in enhanced mechanical strength and consistent performance, ensuring a highly efficient thermal solution for various high-performance environments.

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