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Brass Push Pin BGA Heatsink
The Brass Push Pin BGA Heat Sink is made from premium aluminum with a black anodized finish, designed to efficiently dissipate heat from BGA components. Equipped with brass push pins for easy installation, it provides secure contact. Its grid-like fin structure enhances airflow, optimizing cooling performance. Ideal for compact electronics.INQUIRE NOW
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Heatsink With Adhesive Thermal Pad
The Heat Sink with Adhesive Thermal Pad is made of high-quality aluminum with a black anodized finish for efficient heat dissipation. It features an adhesive thermal pad for easy and secure installation, ensuring excellent surface contact. Its vertical fin design enhances airflow, providing effective cooling for electronic components. Ideal for compact electronics needing reliable thermal management.INQUIRE NOW
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Heatsink With Adhesive Thermal Pad
The Heat Sink with Adhesive Thermal Pad is crafted from high-quality aluminum with a black anodized finish, providing efficient heat dissipation. Featuring a pre-applied adhesive thermal pad, it allows for easy and secure attachment, ensuring optimal contact. The vertical fin design maximizes airflow for improved cooling performance. Perfect for compact electronic devices requiring reliable and convenient thermal management.INQUIRE NOW
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DSH Heatsink
The DSH Heat Sink is a premium aluminum heat sink designed to offer exceptional heat dissipation for large electronic components. Its extensive surface area, coupled with a horizontal fin design, maximizes airflow and ensures efficient cooling performance. The durable black anodized finish enhances both thermal conductivity and corrosion resistance, making it ideal for high-power applications that require reliable heat management. Perfect for industrial and commercial electronic systems that demand robust thermal solutions.INQUIRE NOW
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Aluminum Cover PCI
The Aluminum Cover PCI is crafted from high-grade aluminum with a brushed finish, offering both durability and a sleek look. Designed for use in PCI expansion slots, it provides robust protection for internal components while also enhancing heat dissipation. The lightweight, precision-engineered design ensures easy installation and secure fitting, ideal for maintaining both aesthetics and functionality in computer systems.INQUIRE NOW
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BGA Heatsink
The BGA Heat Sink is made from high-quality aluminum with a natural finish, designed for efficient cooling of Ball Grid Array (BGA) components. Its rectangular shape with precision-engineered pins maximizes surface area for improved airflow and heat dissipation. Lightweight yet robust, this heat sink is perfect for applications requiring effective thermal management to ensure stable performance and extend the lifespan of electronic components. Ideal for use in compact electronics where efficient cooling is essential.INQUIRE NOW
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