The BGA Heat Sink is made from high-quality aluminum with a natural finish, designed for efficient cooling of Ball Grid Array (BGA) components. Its rectangular shape with precision-engineered pins maximizes surface area for improved airflow and heat dissipation. Lightweight yet robust, this heat sink is perfect for applications requiring effective thermal management to ensure stable performance and extend the lifespan of electronic components. Ideal for use in compact electronics where efficient cooling is essential.
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Crystal Xi
