This BGA heat sink is engineered from high-quality aluminum in a natural finish, designed to provide efficient heat dissipation for Ball Grid Array (BGA) components. Its cube-like design with vertical fins ensures optimal airflow, enhancing cooling performance for compact electronics. With precision extruded fins, this lightweight and durable heat sink effectively prevents overheating, extending the lifespan of your electronic components and ensuring reliable performance even in high-power applications. Ideal for a variety of thermal management needs in space-constrained environments.
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Crystal Xi
