This BGA heat sink features high-quality aluminum construction in a natural finish for effective heat dissipation. Its vertical fin design maximizes airflow, ensuring efficient thermal management for Ball Grid Array (BGA) components. Ideal for compact electronics, it offers durable, lightweight cooling to maintain stable temperatures and extend component life. The heat sink's precision-extruded design is perfect for enhancing performance in high-power BGA applications, providing reliable cooling and optimal efficiency.
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Crystal Xi
